Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: In this letter, an effective scheme to mitigating mutual coupling in patch array utilizing a $\pi$-shaped structure and coplanar ground is proposed. By properly adjusting the decoupling ...
Developers are navigating confusing gaps between expectation and reality. So are the rest of us. Depending who you ask, AI-powered coding is either giving software developers an unprecedented ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback