Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Abstract: This paper investigates and implements a miniaturized microwave system for microstrip linear array antenna that operates in X-band (10.1 GHz), S-band (3.4 GHz) and C-band (5.6 GHz). The ...
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