Darin Green has been promoted to Global Chief Revenue Officer, assuming responsibility for revenue generation across all global markets. Under Green’s leadership, North America achieved significant ...
The Smart Brick has a 4.1mm ASIC chip inside of it that Lego says is smaller than a standard Lego stud. It runs something ...
Abstract: This article presents the D-band characterization of General Electric’s (GE) high-purity fused-silica (HPFS) substrate processing using microstrip ring resonator (MRR) and required passive ...
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