A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], ...
Fuji Electric has announced an agreement with Robert Bosch GmbH to collaborate on SiC power semiconductor modules for ...
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
In 2004, Intel specified a standard integrated Driver-MOSFET (DrMOS) device for use in a typical PC platform. This specification’s goal was to provide features for an integrated device to produce the ...
The AI boom is driving up the power demands of CPUs, GPUs, and other high-performance SoCs in data centers—and they show no signs of slowing down. Today, the most advanced AI chips are bordered on ...
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