TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

The majority of the credit goes to the DRAM, and then comes the chip costs. The year 2026 will see a breakthrough into the 2nm era. Apple has reportedly booked more than half of TSMC’s 2nm capacity.

The Fruity Cargo Cult Apple has reportedly signed up for more than half of TSMC’s 2nm production capacity in 2026, effectively elbowing rivals out of the queue for the world’s most advanced silicon.

Industry experts are closely tracking the development of the Apple 2nm A20 Pro chipset, expected to launch in late 2026.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

New leak says Snapdragon 8 Elite Gen 6 and Dimensity 9600 will utilize TSMC's 2nm N2P process to take on Apple's A20 and A20 ...

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Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new entrant, CoWoP (Chip ...

TSMC confirmed on Thursday that the U.S. Department of Commerce has approved a one-year export license for its Nanjing chip ...

Nvidia and TSMC announced Friday their first completed U.S.-made wafer that will eventually become Blackwell chips for AI purposes, Nvidia first tells Axios. Why it matters: This milestone represents ...