CPS Technologies offers aluminum-silicon-carbide (AlSiC) metal-matrix composite pin-fin substrates for liquid-cooled high-power module systems used in hybrid electric vehicle (HEV) applications.
Pairing strength and stiffness, the company’s AlSiC pin fin coolers meet the challenges associated with keeping IGBT power modules cool in hybrid electric vehicles (HEVs). To dissipate heat in the ...
Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...
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