Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

Offering customers a new alternative to Standard Cell ASICs, ChipX has introduced a line of Embedded Array products built with Structured ASIC libraries, also known as a Structured ASIC fabric. ChipX ...

This file type includes high resolution graphics and schematics when applicable. In the development of SoC-based (system-on-chip) circuit boards, the SoC’s additional capabilities will provide ...

High-density interconnect (HDI) technology allows printed-circuit board (PCB) designers to increase routing density, reduce layer count, and improve the thermal and electrical characteristics of their ...