JSTOR Daily

Approximating multiple integrals over non-rectangular compact set using α-dense curves

In this paper, we develop a method for approximating multiple integrals. The domain of integration Ω is assumed to be a non-rectangular compact of ℝⁿ. The main idea is the dimensionality reduction ...
Semiconductor Engineering

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...
Semiconductor Engineering

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration

New research paper titled “Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)” from researchers at Tokyo ...
AZOM

Integration of Two-Dimensional Materials on Silicon Microchips

The semiconductors industry is expected to be revolutionized by two-dimensional materials. Still, while multiple studies have noted prototype devices comprising hopeful properties for driving and ...
Nanowerk

Integrating dimensions to get more out of Moore's Law and advance electronics

(Nanowerk News) Moore's Law, a fundamental scaling principle for electronic devices, forecasts that the number of transistors on a chip will double every two years, ensuring more computing power — but ...