InfraTec and Volkswagen Sachsen have been working together since 2007 on non-destructive methods for quality assurance in car ...

As additive manufacturing (AM) parts become more complex, so does the testing. To accommodate the testing of AM metal parts, Plastometrex uses profilometry-based indentation plastometry (PIP). PIP can ...

5G is moving fast. In 2018, we saw the emergence of the first chipsets. This year, we will see the first commercial deployments of next generation Node B 5G base stations (gNBs) and devices. The ...

The U.S. Commerce Department outlined proposed rules for the Chips for America Incentives Program, including additional details on national security measures applicable to the CHIPS Incentives Program ...

Thanks to revisions in the Bluetooth Specification-Core and advances in technology, companies supplying Bluetooth components and software now can confidently market their products. It’s also time for ...

TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for ...