Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Thermal simulation supports engineers who design electronic products, particularly those that dissipate substantial power. If the thermal-simulation tool is easy to use and provides clear results, ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
is the thermal resistance between the object and the environment. The problem is to determine whether the integrated circuit in question is reliable at high temperatures. Without a particular method ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback