SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Standard electrogalvanized coating thicknesses tend to range from 5 µm to 8 µm. Homogeneity is key to ensuring premium adhesive behavior, in terms of the upper layers’ adhesion to the coating and the ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

A joint research team has successfully identified, for the first time, the specific types of defects responsible for efficiency loss in silicon heterojunction (SHJ) solar cells. Subscribe to our ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Semiconductor manufacturing creates a wealth of data – from materials, products, factory subsystems and equipment. But how do we best utilize that information to optimize processes and reach the goal ...

Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...

An international research group has found that the presence of a few lattice defects in a kesterite PV cell material can actually improve efficiency, rather than lowering it. The group believes that ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

Electron diffraction is a powerful analytical technique used to study the atomic structure of materials. It involves the interaction of a beam of electrons with a crystalline sample, resulting in a ...