Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem's (SMTK) advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025. Visit Manz Asia at Booth no.

Joint Development Agreement builds on ongoing collaboration with Manz Asia As demand for AI computing accelerates, advances in 12" wafer-level packaging and large-area panel packaging could offer a ...

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

The Data Center AI Chip Packaging market is becoming a critical pillar of the global artificial intelligence ecosystem, and ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. Packaging: A 30-Year Career Retrospective We’ve come a very ...

Apple is in talks with suppliers to manage iPhone chip assembly and packaging in India for the first time, reports The Economic Times. "Exploratory conversations" are said to have taken place with ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...