Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Fairchild Semiconductor's FDMF6700 is an optimized and integrated FET-plus-driver power stage in a 6-mm x 6-mm MLP package. Fairchild Semiconductor’s FDMF6700 is an optimized and integrated ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
Joule is the latest product in Intel’s family of all-in-one chip modules for the Internet of Things. Intel CEO Brian Krzanich showed off the new Joule module during a keynote speech at the Intel ...
NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
The big drivers of 5G mobile network adoption are higher bandwidth, lower latency and higher reliability. For 5G chipmakers, this translates into a need for 5G chips and modules with higher efficiency ...
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